ASUS today unveiled the first motherboard in their new development “TUF” (The Ultimate Force) in the series, the SABERTOOTH 55i
TUF series is specially developed to meet the demands of heavy computer users of energy and perform well even under extreme conditions. These computer enthusiasts often demand components of the motherboard high-quality and more stable computing platforms.
To achieve stability without compromise, TUF series of motherboards have been subjected to more stringent testing program than producers now undertake most of the motherboard. Solidly built and equipped with heavy-duty components that have passed stringent tests of military style, the triumphs of the TUF series in the harshest operating conditions to provide a solid performance. 55i SABERTOOTH debut model, designed around a “Marine Cool” concept incorporates the Intel P55 chipset and “hard” features to give users a computer platform extremely solid and stable.
The motherboard, equipped with the new Ceram! Heatsink X, offering exceptional cooling to active components and uncompromising system stability even under severe operating conditions. With its advanced ceramic composition based commonly used in the aerospace industry for thermal insulation of the heat sink dissipates quickly to achieve final cooling. Ceramics replace traditional anti-oxidant compounds to create a textured surface for improved cooling Microfin. This rough surface provides an enhanced space for the induction of heat into the surrounding air. As a result, more heat is dissipated rapidly in the active system-allows users to enjoy before unattainable levels of stability.
Because optimal memory operation depends on good refrigeration, 55i SABERTOOTH CoolMem motherboard comes! Fan frame that encloses most standard 40mm or 50mm computer fans and fits directly on the memory module. Thus, users obtain an economical cooling solution that significantly stabilizes the functioning of memory.
The motherboard provides D.S. SABERTOOTH 55i (Efficient Switching Power) to all major components for excellent system efficiency. Besides delivering energy efficient CPU and memory, power design also applies the same level of energy efficient PCIEx16 expansion slots and IC. This improves overall energy efficiency and reduces the amount of heat generated, resulting in cooler operation and more reliable. In addition, the D.S. power converted into an efficiency of 90% compared with a conventional linear design that only about 60% efficiency.